For the manufacturing of pan-semiconductor control cabinets and wiring assemblies, we have designed an exclusive cleanliness process, with all links meeting standards:

Cleanliness Pre-treatment: Sheet metal parts are ultrasonically cleaned with deionized water + special cleaning agent (40-50℃, 15-20 minutes); before unpacking, electrical components pass through an air shower (air speed ≥25m/s) to remove particles.

Precision Assembly: Modular assembly is carried out at Class 100 workstations, using anti-static tools and dust-free wires, with terminals inspected under a microscope; after assembly, the cabinet is purged with clean compressed air filtered to 0.1μm.

Cleanliness Testing: The dedicated area is equipped with EMC equipment for testing, with a shield to isolate interference, and surface particles are monitored to be ≤10 particles/cm².

Compliance & Traceability: Personnel gain access after training, changing clothes for disinfection, and air shower (≥30 seconds), ensuring the entire process is controllable.